semiconductor-packaging

MPSim (Material Property Simulation) — effective properties of semiconductor materials from their microstructure, on voxel RVEs

免费中文先进封装课程 / Free Chinese-language course: 40 lessons on Chiplets, HBM, 2.5D/3D, engineering, and industry research.

1D Phononic Acoustic Blackbody (PAB) Thermal Interface Architecture

MPSim with requests in words: a local language model reads the request, rules check it against the sentence, MPSim runs it. Offline.

Unpublished patent-pending architecture for practical NVIDIA-class CoWoP realization in AI/HPC GPU systems.

Signal-integrity study of microstrip, stripline and embedded-microstrip package interconnects: Ansys Q2D RLGC extraction, parametric sweeps, soldermask loading and RC crosstalk simulation. A Python toolkit reads the solved Ansys data directly to reproduce the results, recompute Z₀ and modal loss, and audit mesh convergence.

SCITEO 峻茂新材料 — high-end advanced adhesives manufacturer: −255 to 1000 °C, 1.5–60 W/m·K, CTE 7.1–40 ppm/°C, modulus 2.6–15 GPa. Semiconductor packaging, automotive, extreme-temperature and ultra-precision manufacturing.

SCITEO (峻茂新材料) | −255 to 1000 °C, 1.5–60 W/m·K, CTE 7.1–40 ppm/°C, modulus 2.6–15 GPa, shear 5–32 MPa. Seven product lines for semiconductor packaging, automotive electronics, extreme-temperature components and ultra-precision manufacturing.

Analytical warpage & thermo-mechanical stress toolkit for wafer-level packaging (WLP): Stoney / Timoshenko / N-layer laminate models, interactive Streamlit dashboard, validated against classical closed-form results.

End-to-end fabrication and characterization of a glass-core package substrate for heterogeneous integration.

A hands-on exploration of semiconductor packaging — covering package types, ATMP processes, thermal simulation of flip-chip BGA packages, reliability testing, and 3D package cross-section modeling using ANSYS Electronics Desktop (AEDT).

Amkor Technology — independent third-party profile of a public API surface, by API Evangelist. Amkor Technology is the world's largest US-based provider of outsourced semiconductor packaging and test services (OSAT), serving integrated device manufacturers, fabless semiconductor companies, and contract foundries.