Improve workflow editor and deployment experience #25912
ci.yml
on: pull_request
Detect Version
0s
Migrate Dev DB
/
Apply Database Migrations
Detect Desktop Changes
0s
Matrix: Build AMD64
Matrix: Build ARM64 (GHCR Only)
Test and Build
/
Lint and Test
2m 54s
Test and Build
/
Build App
2m 8s
Check Docs Changes
0s
Matrix: Build Dev ECR
Deploy Trigger.dev (Dev)
Matrix: Create GHCR Manifests
Process Docs
/
Process Documentation Embeddings
Prune Desktop Prereleases
0s
Desktop Release
/
Build, Sign, Notarize
Annotations
4 errors and 6 warnings
|
Test and Build / Lint and Test
Process completed with exit code 1.
|
|
components/emails/_styles/base.tokens.test.ts > email geometry mirrors the platform > the CTA transcribes chipGeometryClass:
apps/sim/components/emails/_styles/base.tokens.test.ts#L97
AssertionError: expected '${chipGeometryWithoutRadiusClass} rou…' to contain 'h-[30px]'
Expected: "h-[30px]"
Received: "${chipGeometryWithoutRadiusClass} rounded-lg"
❯ components/emails/_styles/base.tokens.test.ts:97:24
|
|
Test and Build / Lint and Test
sim#test: command (/home/runner/_work/sim/sim/apps/sim) /home/runner/.bun/bin/bun run test exited (1)
|
|
Test and Build / Lint and Test
Process completed with exit code 1.
|
|
Test and Build / Lint and Test
Skipping sticky disk commit due to previous step failures
|
|
Test and Build / Lint and Test
Found 2 failed/cancelled steps in previous workflow steps
|
|
Test and Build / Lint and Test
Skipping sticky disk commit due to previous step failures
|
|
Test and Build / Lint and Test
Found 2 failed/cancelled steps in previous workflow steps
|
|
Test and Build / Lint and Test
Skipping sticky disk commit due to previous step failures
|
|
Test and Build / Lint and Test
Found 2 failed/cancelled steps in previous workflow steps
|